Proceedings
of the 2nd International Conference on
Benefiting from Thermal
and Mechanical Simulation in (Micro)-Electronics
Edited
by
G. Q.Zhang
L. J.Ernst
O. de Saint Leger
ISBN 0-7803-9806-8,
344 Pages - Prix 100 euros
Editorial
The organising and
technical committees welcome the participants to the 2nd international
conference on "Benefiting from Thermal and Mechanical Simulation
in (Micro-) Electronics" (EuroSimE 2001) at Maison de la
Chimie, Paris, France. The conference is organised by the thematic
network COMPETE (www.compete.tm.fr) with major financial sponsoring
by the EC, and technical co-sponsoring by IEEE CPMT and IUTAM.
As the only international
conference specially dedicated to various mechanical and thermal
issues in (micro-) electronics, EuroSimE2001 aims to:
- emphasis the fact
that (micro-)electronics is becoming a major driven force and
impulse for the further development of mechanics,
- draw attention from
both academic societies and electronic industry for the significant
impact of thermal and mechanical related issues on both the electronic
industry and modern human life,
- demonstrate the state-of-the-art
competencies and the challenges facing mechanics professionals,
- promote further research
and development for mechanics of (micro-) electronics,
- promote further development
and application of simulation & optimisation methodologies
and tools for the electronics industry,
- improve communication
and exchange information between methodology & tool-developers
and industry users,
- strengthen co-operation
between industry, universities, and research institutes.
This year, more than 50 papers are selected from many countries
all over the world. Compared with EuroSimE 2000, EuroSimE 2001
has a clear international character, which will be further strengthened
in the subsequent ESIME-conferences.
There are totally 8 different sessions entitled Keynote Lectures,
Process/Product Design Optimisation, Thermal Mechanical Simulation,
Thermal Management, Mechanical Simulation, Verification and Testing,
Material Characterisation and Modelling, and Poster. In those
sessions, the results of both fundamental research and industrial
applications in the fields of thermal and mechanics of (micro)-electronics
are presented. This includes the application fields of:
- Wafer processing
and chip design
- PWB design and application
- Components and packaging
(traditional packages, flip-chip, BGA, CSP, Wafer-Level packages,
MCM, Opto-electronic packages, MEMS)
- Microsystems
- Interconnections
- Systems
- Materials of (micro)-electronics
- Processes in (micro)-electronics
Those 8 sessions cover
a broad field of technical subjects including mechanical simulation
(both static and dynamic); thermo-mechanical simulation; thermal
management; material characterisation and modelling; thin-film
mechanics; failure criteria and damage-modelling; continuum and
micro-mechanics in (micro)-electronics; interface strengths;
experiments for model verification; (micro)-electronic product
and/or process optimisation; simulation-based optimisation; virtual
thermo-mechanical prototyping in product and/or process design;
multi-physics simulation; advanced numerical and analytical simulation
methodologies and tools.
The organising and
technical committees would like to thank all sponsors, speakers,
exhibitors, and participants for their valuable support and contribution
in making EuroSimE 2001 a success.
G.Q. Zhang, L.J. Ernst and O. de Saint
Leger
Sommaire /
Contents
COMPETE, the European
Thematic Network on Microelectronics Packaging and Interconnection.
O. de Saint Leger,
COMPETE co-ordination at MTA, Paris, France
Mechanical Simulation
in Microelectronics and Photonics Packaging
E. Suhir, Bell
Laboratories, Lucent Technologies, Inc. USA
Electronics Trends
in Mobile Communications
H. Huomo, Research
& Technology Access of Nokia Mobile Phones, Finland
Silicon Technology
in the 21st Century
A.J. van Roosmalen,
Philips Semiconductors, The Netherlands
Virtual Thermo-Mechanical
Prototyping of Microelectronics - The challenges for mechanics
professionals
G.Q. Zhang, P.
Maessen, J. Bisschop, J. Janssen, F. Kuper, Philips, The Netherlands,
L.J. Ernst, Delft University of Technology, The Netherlands
Trends in the Application
of Mechanics to (Micro-) Electronics
Dick H. van Campen,
Secretary-General of IUTAM, Eindhoven University of Technology,
The Netherlands
Response Surface Modelling
for Non-linear Packaging Stresses
W. van Driel,
G.Q. Zhang, J.W. Bergsma, G. Steenbergen, Philips, The Netherlands,
L. J. Ernst, Delft Univ. of Techn., The Netherlands
Robust Multiple Criteria
Optimization of Thermally Enhanced PQFP
Chia-Lung Chang,
Wei-Shin Lin, Nat.Yunlin Univ. of Sc. & Techn. Touliu, Yunlin,
Taiwan
Simplified Mechanical
Model for the Thermomechanical Warpage of Microelectronic Packages
Using Response Surface Methodology
Eric Egan, National
Microelectronics Research Centre (NMRC), Nat. Univ. of Ireland,
Gerard Kelly, Cork Institute of Technology, Ireland, Tom O'Donovan,
Statistics Department, National University of Ireland, Cork,
Ireland
Parameterised Modelling
of thermo-mechanical reliability for a 5x4 CSP
B. Vandevelde,
E. Beyne, IMEC, Leuven, Belgium, G.Q. Zhang, J. Caers, Philips
CFT, The Netherlands
Thermo-mechanical
Reliability of Multilayer Ceramic Capacitors: Measurement and
Computation
J.M.J. den Toonder,
C.W. Rademaker, Philips, The Netherlands
Probabilistic Approach
to Numerical Assessment of Electronic Component Reliability
A. Wymyslowski,
Wroclaw Univ. of Techn., Inst. of Microsyst. Techn., Wroclaw,
Poland
Thermally Induced
Delamination-Buckling in a Metal-Ceramic Microelectronic Product
C.J. Liu, L.
J. Ernst, G. Wisse, Delft Univ. of Techn., The Netherlands, G.
Q. Zhang, M. Vervoort, Philips CFT, The Netherlands
Effect of Chip Anisotropy
on Packaging Process Induced Stresses
J. Janssen, W.
van Driel, J. Bisschop, F. Kuper, R. Schravendeel, Y. Li, G.Q.
Zhang, Philips, The Netherlands, D.G. Yang, L.J. Ernst, Delft
Univ. of Techn., The Netherlands
Modelling of Heat
Transfer for System In a Package (SIP)
Jiemin Zhou,
Central south Univ., Changsha, P.R. China, Xitao Wang, Liu Chen,
Johan Liu, Chalmers Univ. of Techn. Gothenburg, Sweden
Actuation Unit Analysis
of a Thermo-Pneaumatic Actuated Micropump
M. Carmona, S.
Marco, J. Samitier, Universitat de Barcelona, Spain,.M.C. Acero,
J.A. Plaza, J. Esteve, Centro Nacional de Microelectrónica.
(IMB-CSIC), Spain
A New Thermal Simulation
Tool for Optimizing Laser Desoldering of Flip-Chip Components
G. Hanreich,
J. Nicolics, Vienna Univ. of Technology, Austria
Numerical Simulation
of Embedded Passive Components in Multi-layer PCBs
D. M. Stubbs,
S. H. Pulko, A. J. Wilkinson, Univ. of Hull, United Kingdom
Thermal Investigation
of a Jedec MO-166 Package by Finite Element Simulations
Kirsten Weide,
Univ. Hannover, Lab. für Inform. Techn
Neural Network Methodologies
for Modeling, Simulation, and Optimization
Q.J. Zhang, Carleton
Univ., Ottawa, Ontario, Canada
Design for Flip Chip
on Flex: A Combined Thermal & Mechanical Modeling & Analysis
Xuejun Fan, Philips,
USA
Lifetime Prediction
of Extended Flip-Chip Packages under Thermal and Mechanical Loading
B. Wunderle,
W. Nüchter, Robert Bosch GmbH, Stuttgart, Germany, A. Schubert,
B. Michel, Fraunhofer IZM, Berlin, Germany
High Temperature Thermo-Mechanical
Analysis of Gas Sensors Substrates
J.Puigcorbé,
A.Vilà, J.R. Morante, Universitat de Barcelona, Spain
An Optimized Shear
Test Sample for Assessing Solder Deformation Properties
Tommi Reinikainen,
Wei Ren, Nokia Mobile Phones, Irving, Texas
Structure Investigation
of Quad Flat Non-lead Package to Improve Radio-Frequency Application
Nansen Chen,
Kevin Chiang, Charley Kuo, Kelly Liu, Terry Hsu, T. D. Her, SPIL,
Taiwan
Experimental Verification
of Analytical and FE-models Through Micro-Raman Spectroscopy
Ingrid De Wolf,
Imec, Leuven, Belgium
Characterisation of
Lead-Free Solders in Flip Chip Joints
S. Wiese, F.
Feustel, E. Meusel, Techn. Univ. Dresden, Inst. für Halbleiter-
und Mikrosystemtechnik, Germany
Time and Temperature
Dependent Thermo-Mechanical Characterization and Modeling of
a Packaging Molding Compound
M. S. Kiasat,
L. J. Ernst, Delft Univ. of Techn., The Netherlands, G. Q. Zhang,
R. Bressers, Philips, The Netherlands
Process Induced Residual
Stress Prediction for Microelectronic Packaging Materials During
Cure
H.A. de Boer,
M.H.H. Meuwissen, M.C. van der Wekken, TNO, The Netherlands,
P.J.G. Schreurs, M.G.D. Geers, Technical Univ. of Eindhoven,
The Netherlands
Material Mechanics
and Reliability Issues of Lead-Free Solder Interconnects
A. Schubert,
H. Walter, E. Jung, A. Gollhardt, Fraunhofer-IZM, Berlin, Germany
Numerical Optimisation
of Gold Creep Model for Thermocompression Bonding
J. Puigcorbe,
S. Marco, S. Leseduarte, Universitat de Barcelona, Spain, O.
Vendier, C. Drevon, Alcatel Space, Toulouse, France, D. Floriot,
Thomson-CSF-LCR, Orsay, France, H. Blanck, United Monolithic
Semiconductors GmBH, Ulm, Germany, P. Auxemery, United Monolithic
Semiconductors SAS, Orsay, France
Nano-scratch Behaviour
of Diamond-like Carbon Films
Li-ye Huang,
Ke-wei Xu , Jian Lu, Xian Jiaotong Univ. China, Bruno Guelorget,
Univ. de Techn. de Troyes, France
Measurement of Thermal
Deformation of Interconnection layers Using SIEM
Sheng Chang,
Fu-Pen Chiang, State Univ. of New York at Stony Brook, USA ,
Yifan Guo, Motorolla Semiconductor Products Sector, Tempe Arizona,
USA
Analysis of Damage
Mechanisms at Miniaturized Solder Joins, Essentials for Life
Time Predictions
H.J. Albrecht,
B. Schwarz, Siemens AG, Berlin, Germany
Three- and Four-Point
Bend Testing for Electronic Assemblies
Santosh Shetty,
Tommi Reinikainen, Nokia Mobile Phones, Irving, Texas
Local Stress Analysis
on Polymer Stud Grid Array (PSGA) Packages by Raman Spectroscopy
and FEM Simula
Jian Chen, Bart
Vandevelde, Ingrid De Wolf, Imec, Leuven, Belgium, Jef Van Puymbroeck,
Marcel Heerman, Siemens, Oostkamp, Belgium
Reliability Prediction
of Area Array Solder Joints
Rainer Dudek,
Ralf Döring, Bernd Michel, Fraunhofer IZM, Berlin, Germany
An Integrated Modelling
Approach to Solder Joint Formation and Fatigue Life Analysis
Pan Kai-lin,
Zhou De-jian, Chen zi-chen, Huang Chun-yue, Qin Kuang-yu, ZheJiang
Univ., HangZhou, PRC
Packaging Induced
Die Stresses Considering Time-dependence of a Moulding Compound
J. Janssen, W.
van Driel, J. Bisschop, F. Kuper, R. Schravendeel, Y. LI, R.
Bressers, G.Q. Zhang, Philips, The Netherlands, M.S. Kiasat,
L.J. Ernst, Delft Univ. of Techn., The Netherlands
Coupling of Mechanical
and Electrical Behaviours Around a Notch Tip in Piezoelectric
Medium
Y.L. Li, Y. Sato,
K. Watanabe, Univ. of Tokyo, Japan
Modelling and Simulation
of an Electrostatically Actuated Surface-Micromachined Tunable
Fabry-Perot Microinterferometer for the Medium IR Spectral Range
C. Calaza, M.
Moreno, S. Marco, Universitat de Barcelona, Spain, L. Fonseca,
C. Cané, I. Gràcia, Centro Nacional de Microelectrónica
(IMB-CSIC), Barcelona, Spain
Force Constants for
liquid solder bumps with unequal padsizes
Co Van Veen,
Philips CFT, The Netherlands, Bart Vandevelde, Eric Beyne, Imec,
Belgium
Numerical Simulation
of Delamination in IC Packages Using a New Variable-order Singular
Boundary-element
A. A. O. Tay,
K. H. Lee and K. M. Lim, Centre for IC Failure Analysis and Reliability,
Nat. Univ. of Singapore
Numerical Method of
Reliability Assessment of the Flip-Chip Packaging
J. Dziduszko,
A. Wymyslowski, K. Friedel, Wroclaw Univ. of Techn. Poland
Thermal Management
in a New Utra-thin Chip Stack Technology
S. Pinel, J.
Tasselli, J.P. Bailbe, A. Marty, LAAS-CNRS, Toulouse, France,
O. Vendier, M. Huan, ALCATEL SPACE, Toulouse, France, S. Marco,
J.R. Morante, Univ. of Barcelona, Spain, E. Beyne, R. Van Hoof,
IMEC, Leuven, Belgium
State-Of-The-Art of
Thermo-Mechanical Modelling of IC Back-End Processes
R.B.R. van Silfhout,
A. de Boer, H.J.M. Geijselaers, Technical University of Twente,
The Netherlands Y. Li , J. Bisschop, F. Kuper, R. Schravendeel,
J.H.J. Janssen, W. van Driel, G.Q. Zhang , M. Jansen Philips,
The Netherlands
Performance of a Thermo-Pneumatic
Actuated Micropump: Influence of the Fluidic Components
M. Carmona, S.
Marco, J. Samitier, Univ. de Barcelona, SIC, Spain
SPICE Based Simulations
of Electrothermal Processes
Piotr Dziurdzia,
Univ. of Mining and Metallurgy, Inst. of Electr., Kraków,
Poland
A Robust Implementation
of Stress Governing Equations for Next Generation Process Simulators
Slobodan Mijalkovic,
Wim Crans, Delft Univ. of Techn. ITS/DIMES
Effect of Carrier
and Retain Ring Mechanism of Chemical-Mechanical Polishing of
the Axial Deformation on Wafer Surface
Zone-Ching Lin,
Nat. Taiwan Univ. of Sc. & Techn.,Taipei, Taiwan
Micro to Macro Thermo-Mechanical
Simulation of Wafer-Level Packaging
C.A.Yuan, K.N.
Chiang, National Tsing Hua University, Taiwan
Numerical Simulation
of Reactive Interdiffusion in Thin Layers
X. Federspiel,
M. Ignat, LTPCM/INPG, France
Computer Simulation
of Grain Growth in a Bidimensional Polycrystalline Films
Jianmin Zhang,
Kewei Xu, Vincent Ji, Xian Jiaotong Univ. China/ENSAM, Paris,
France
Finite Element Modelling
of Solder Joint Reliability of Plastic Ball Grid Assembly Under
Thermal Cyclic Loading
X. J. Zhao, Philips
CFP, Singapore, G. Q. Zhang, J. Caers, Philips CFP, The Netherlands,
L.J. Ernst, Delft Univ.of Techn., The Nethelands
A user-friendly thermo-mechanical
stress test chip concept; does this exist ?
Daniel Vanderstraeten,
Gust Schols, Alcatel Microelectronics, Belgium, Oliver Kierse,
James Molyneaux, Analog Devices Bv, Ireland, Orla Slattery, Kieran
Delaney, National Microelectronics Research Centre, Ireland,
Jozef Vanneuville, Klaas Decat, IMEC-KHBO, Belgium, Chan Geok
Chai Moses, CS2, Belgium
